The Low Profile Underfloor Heating System with Spider Panel technology is designed for renovation projects and applications where floor build-up height is limited.

The durable Spider Panel securely holds the heating pipe in place while ensuring optimal heat distribution across the floor surface. With a total system height of only 25 mm (22 mm panel and pipe plus 3 mm self-leveling screed), it provides an efficient heating solution without significant changes to existing floor levels.

Installed directly over a suitable subfloor, the system is covered with a self-leveling screed and finished with vinyl, laminate, tile, or other compatible floor coverings. The low thermal mass allows for faster heat-up times and improved temperature control compared to traditional in-slab heating systems.

Key Benefits:

• Ultra-low build-up height
• Fast response time
• Even heat distribution
• Ideal for renovations and retrofit projects
• Compatible with heat pumps and high-efficiency boilers
• Energy-efficient radiant heating comfort
• Suitable for a wide range of floor finishes